Assoc. Prof. Shuibao Liang, Hefei University of Technology, China

梁水保 副教授，合肥工业大学

Dr. Shuibao Liang is an Associate Professor at Hefei University of Technology. He received the Ph.D. degree from South China University of Technology in 2019, after that he worked as a postdoctoral researcher at Loughborough University, UK, and joined Hefei University of Technology in 2023. His research interests include electronic packaging, reliability analysis of electronic products, power electronics, and material processing simulation. He participated in a number of NSFC and Engineering and Physical Sciences Research Council (EPSRC, UK) projects, and published more than 30 academic papers in the in well-known academic journals, such as Microelectronics Reliability, IEEE TDMR, IEEE CPMT, Journal of Applied Physics, Scripta Materialia; and presented his research at international conferences on electronic components and packaging reliability (ECTC, ESTC, ICEPT, ESREF, etc.), and won the Best Student Paper Award and Outstanding Paper Award at the International Conference on Electronic Packaging Technology.

梁水保，博士，合肥工业大学副教授。2019年6月在华南理工大学获工学博士学位，后于英国拉夫堡大学从事博士后研究工作，2023年加入合肥工业大学。主要从事微电子制造和电子封装中互连结构在多物理场下微结构特征及元器件物理可靠性相关的研究工作，迄今已参与了多项国家自然科学基金及英国工程与自然科学基金（EPSRC）项目，在微电子可靠性、应用物理、加工制造等领域发表学术论文40余篇，多次获邀参与领域内知名电子元器件及封装可靠性类国际会议(ECTC、ESTC、ICEPT和ESREF等)和报道研究成果，并获得电子封装技术国际会议最佳学生论文奖和杰出论文奖。