2024 3rd International Symposium on Semiconductor and Electronic Technology(ISSET 2024)
Welcome Senior Eng. Chenggang Zhou, University of Science and Technology of China, China​​ to be the TPC!

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Senior Eng. Chenggang Zhou, University of Science and Technology of China, China

周成刚 高级工程师,中国科学技术大学


Chenggang Zhou, is a senior engineer(PhD) and deputy director of the USTC Center for Micro and Nanoscale Research and Fabrication. His research interests include the design of micro-nano devices, processing technology and its interdisciplinary application. So far, he has participated in a number of National Natural Science Foundation, strategic pilot projects of Chinese Academy of Sciences and national key research and development projects, and has accumulated rich engineering experience in the fields of micro-nano processing equipment development and platform construction, test and measurement technology and instrument development, chip failure analysis and detection.

周成刚,博士,中国科学技术大学微纳研究与制造中心副主任,高级工程师。主要从事微纳米器件设计、加工技术及其学科交叉应用等研究。迄今已参与了多项国家自然科学基金、中科院战略先导专项及国家重点研发计划项目,在微纳加工设备开发和平台搭建、测试计量技术与仪器研制、芯片失效分析与检测等领域积累了丰富的工程经验。